The three and a half year APPLAUSE Project came to a close at the end of October 2022. This was followed by the standard final reporting period and final review meeting, held in January 2023.

We will occasionally update this website to reflect the continued impact derived from the project and the strong collaborations. Several presentations, news items and papers have been published during 2023 and these are reflected in the “News” and “Publications” sections. We remain active on our LinkedIn page (APPLAUSE ECSEL Project).

If you require further information or wish to reach out to members of the project, please feel free to contact us with the details listed in this website.

We are happy to share that Applause organized a dissemination day at ESREF conference on Wednesday 28th of September 2022. Continuing with the same core topics, we also organized a summer school targeted for PhD students in the field and junior engineers. This was a great opportunity for young professionals to learn from senior colleagues, to gain insight ranging from the basics, to current state of the art, and to the vision for the future. The event provided a great opportunity to network with representatives from all over Europe.

Follow the links for more details about the two events held.

The drive for new technology in advanced packaging for photonics, optics and electronics is creating an opportunity to build the competitive edge of component and systems development in Europe, while re-establishing the European manufacturing and packaging value chain. The ECSEL JU project APPLAUSE (No. 826588) supports this by building on the European expertise in advanced packaging and assembly to develop new tools, methods and processes for high volume mass manufacturing of electrical and optical components. The technologies will be piloted in 5 industrial use cases, related to

• Ambient light sensor for mobile and wearable applications (ams)
• Thermal IR image sensor for automotive and surveillance applications (IDEAS)
• High speed datacom transceiver technologies with reduced manufacturing costs (NVIDIA)
• Flexible patch for cardiac monitoring (Precordior)
• Miniaturized invasive cardiac sensors (Cardiaccs)

The APPLAUSE consortium is built of a number of leading experts from European electronics packaging companies representing different value chain levels related to advanced packaging and smart system integration. The parties have complementary expertise in conception, design, packaging, testing and manufacturing of electronic components, as well as a wide range of expertise from several different end use areas. The unique European ecosystem established within the consortium represents the competitive, leading edge of the technologies available.